Ultra high vacuum multi chamber physical vapor deposition system

superHigh vacuum multi chamber physical vapor deposition system (PVD)

This system is manufactured by a professional sedimentation equipment manufacturer, equipped with multiple sedimentation methods (with various functional interfaces reserved), highly flexible, and very suitable for scientific research on multiple sedimentation modes

At present, the ultra-high vacuum deposition mode of the system (using only mechanical pumps and molecular pumps, with a maximum vacuum of 5X10E-10Torr). Multiple combination sedimentation modes, achieving multiple functional sedimentation methods in the same chamber. The sedimentation source modes include:
Magnetron sputtering source
Electron beam evaporation source
Thermal evaporation source
The system is highly flexible and the software operation is convenient. It specializes in depositing ultra pure thin films for research institutions and is a true ultra-high vacuum deposition system.
Technical Specifications:
Extreme vacuum:<5x 10E-10 torr (after 24 hours of baking and cooling);
Coating uniformity:<3%
Sample transfer: convenient placement of upper substrate
Cabinet: small space occupying structure;
Sample stage operation: rotation, heating, loading bias voltage;
Sample operation: pre vacuum chamber;
Sample sizes: 1 ", 2", 3 ", 4", 8 ", 12", etc;
Film thickness monitoring: quartz crystal microbalance, ellipsometer;
Baking: built-in heating or external insulation heating;
Simple and convenient fully automatic software operation: Fully automatic vacuum extraction and automatic program operation.