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E-mail
kejing@sykejing.com
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Phone
18624331856,18624331865,18624331992,18624331806,18
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Address
No. 26-2-7 Xuefeng Road, Hunnan New District, Shenyang, Precision Instrument Industrial Park
Product Categories
Shenyang Kejing Automation Equipment Co., Ltd
SYJ-DS100 precision manual cutting machine
NegotiableUpdate on 02/18
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Overview
The SYJ-DS100 precision manual cutting machine is suitable for cutting thin single crystal substrates such as silicon, sapphire, Ge, LiNbO3, and LiTaO3 chips. The cutting pressure can be adjusted by a spring and the cutting stroke is 100mm.
Product Details
The SYJ-DS100 precision manual cutting machine is suitable for cutting thin single crystal substrates such as silicon, sapphire, Ge, LiNbO3, and LiTaO3 chips. The cutting pressure can be adjusted by a spring and the cutting stroke is 100mm.
productname |
SYJ-DS100Precision manual cutting machine |
Main Features |
Cutting process |
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1Adjust the height of the diamond marker 2Adjust the pressure of the spring 3. Place the sample for cutting
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Diamond scriber | |
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1Rotate the diamond cutting height adjustment disc and spring pressure adjustment disc to the origin 0 2Move the slider to the diamond cutting replacement position and remove the guide rod 3Turn the handle 90 degrees to the left 4Loosen the screw with a hex wrench and remove the diamond marker 5Install a new diamond scriber and tighten the screws 6Return the handle to the cutting position and set the guide rod
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productSpecifications |
1. Size:210 mm (L) x 210 mm (W) x 140 mm (H)
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