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Shenzhen Xinouye Instrument Co., Ltd

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    www88888@VIP.126.com

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    18928441536

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    3B-08, 3rd Floor, Dongcheng Building, Longtian Street, Pingshan District, Shenzhen

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Oxford CMI760 PCB Surface Copper/Hole Copper Thickness Gauge

NegotiableUpdate on 01/22
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Overview

The Oxford CMI760 PCB surface copper/hole copper thickness gauge $r $nCMI 700 is designed specifically to meet the needs of copper thickness measurement and quality control in the printed circuit board industry.

Product Details

Oxford CMI760 PCB Hole Copper&Surface Copper Thickness Gauge

Oxford CMI760 PCB Hole Copper&Surface Copper Thickness Gauge CMI700

CMI 700 is designed specifically to meet the needs of copper thickness measurement and quality control in the printed circuit board industry.

CMI 760 can be used to measure the thickness of surface copper and copper inside perforations. This highly scalable desktop thickness gauge system can use both micro resistance and eddy current methods to achieve accurate and precise measurement of surface copper and copper thickness inside perforations. The CMI 700 desktop measurement system has high versatility and scalability, and its compatibility with multiple probes enables it to meet various application requirements, including measuring the thickness of surface copper, perforated copper, and microporous copper, as well as testing the quality of copper in holes.

At the same time, CMI 760 has * statistical function for organizing and analyzing test data.

The CMI 700 configuration includes:

CMI 700 Host and Certificate

SRP-4 probe

SRP-4 probe replacement probe module (1 unit)

NIST certified calibration standards and certificates

Optional accessories:

ETP probe TRP probe SRG software

SRP-4 copper probe testing technical parameters:

Copper thickness measurement range:

Chemical copper: 10 μ in -500 μ in (0.25 μ m -12.7 μ m)

Electroplated copper: 0.1 mil -6 mil (2.5 μ m -152 μ m)

Linear copper can test line width range: 8 mil -250 mil (203 μ m -6350 μ m)

Accuracy: ± 1% (± 0.1 μ m) reference standard film

Accuracy: Chemical copper: standard deviation 0.2%; Electroplated copper: standard deviation 0.5%

Resolution: 0.01 mil ≥ 1 mil, 0.001 mil<1 mil,

0.1μm≥10μm, 0.01μm < 10μm, 0.001μm < 1μm

ETP hole copper probe testing technical parameters:

Tested maximum small hole diameter: 35 mil (899 μ m)

Measurement thickness range: 0.08-4.0 mil (1-102 μ m)

Eddy current principle: comply with the relevant provisions of ASTM-E376-96 standard

Accuracy: ± 0.01 mil (0.25 μ m)<1 mil (25 μ m)

Accuracy: 1.0% at 1.2 mil (30 μ m) (under laboratory conditions)

Resolution: 0.01 mil (0.1 μ m)

Display 6-digit LCD digital display

Measurement unit um mil optional

Statistical data mean, standard deviation, maximum maximum value, minimum value min

Interface 232 serial port, print parallel port

Power supply AC220

Instrument size 290x270x140mm

Instrument weight 2.79kg