09,05,2026 7 views
Audi Wei (920491), the "first sensor stock" on the Beijing Stock Exchange, recently disclosed at an investor relations event that its robot sensor business revenue will exceed 110 million yuan in 2025. At the same time, it has completed the layout of two major cooling solutions, liquid cooling and air cooling, providing key thermal management support for the explosion of AI computing power. The Hong Kong IPO is also steadily advancing through the review stage.
The robot sensor business is growing rapidly, and the multimodal product matrix is fully implemented
Against the backdrop of rapid iteration in the robotics industry, Audi Way has become a core supplier of home service robots by deeply cultivating its technology in the fields of intelligent sensing and precision execution. In 2025, the revenue of the sensor business applied to home service robots by the company exceeded 110 million yuan, marking that this business has grown into one of the core growth poles of the company.
The company has built a complete product matrix covering the perception layer and execution layer, endowing robots with core capabilities such as distance, scale, interaction, texture, and heat dissipation. The core products include:
Environmental Perception Series: obstacle avoidance sensors, collision sensors, material recognition sensors, ultrasonic life detection sensors, achieving precise environmental perception and safety protection;
Precision execution series: force controlled gripper, tactile feedback actuator, piezoelectric stacker, enhancing robot operation accuracy and interactive experience;
Heat dissipation supporting series: Micro jet fan, liquid cooling heat dissipation solution, suitable for high power consumption scenarios of robots for heat dissipation needs.
At present, the company is upgrading from general service robots to intelligent, integrated, and multimodal technologies. The product application scenarios have extended from basic categories such as floor cleaning robots to high-end fields such as commercial service robots and humanoid robots, continuously expanding market space.
Liquid cooled and air-cooled dual wheel layout, accurately matching AI computing power thermal management needs
With the rapid development of artificial intelligence technology, the computing power of AI servers, high-performance computing devices, and intelligent terminals has exploded, and traditional heat dissipation solutions are no longer able to cope with the challenge of high-density heat flow. Audi's forward-looking layout includes two major cooling solutions: liquid cooling and air cooling, forming a differentiated competitive advantage and fully covering the cooling needs of different scenarios.
Liquid cooling solution: Empowering data centers and high-end computing scenarios
The liquid cooling solution focuses on high-density computing scenarios such as intelligent server clusters and data centers. The core product, the vortex flow sensor, has the ability to resist bubbles and impurities, and can stably monitor the coolant flow rate in the main pipeline of the liquid cooling system to ensure efficient operation of the cooling system. Its modular compact design and low pressure loss characteristics can effectively reduce system pumping energy consumption, helping data centers achieve energy conservation and consumption reduction; Simultaneously supporting real-time traffic monitoring and preventive maintenance to enhance system reliability, this technology has achieved significant breakthroughs and is currently cooperating with downstream customers to conduct installation testing and verification. In addition, the company's external clamp type flow sensor can achieve non-invasive flow monitoring, adapt to liquid cooled pipelines of different diameters, and further improve the ecology of liquid cooled products.
Air cooling solution: suitable for smart terminals and lightweight scenarios
The air cooling solution is based on piezoelectric MEMS fans, with the advantages of small size, easy installation, and high heat dissipation efficiency. It adopts piezoelectric drive technology, does not require motors and bearings, and has the characteristics of low noise, long life, and low power consumption. It is an integrated plug and play active heat dissipation solution. The product is widely used in lightweight scenarios such as smart home devices, wearable devices, small servers, and robots, which can effectively solve the heat dissipation pain points of highly integrated smart terminals. Currently, it has achieved large-scale shipment and become an important source of revenue for the company's heat dissipation business.
The steady progress of Hong Kong stock IPOs and the acceleration of globalization layout
In terms of capital operation, the IPO process of Audi Weigang stock is progressing in an orderly manner. The company submitted its prospectus to the Hong Kong Stock Exchange on November 27, 2025, and is currently in the normal review stage. Subsequent approvals or filings from regulatory agencies such as the China Securities Regulatory Commission, the Hong Kong Securities Regulatory Commission, and the Stock Exchange are required, and there is uncertainty regarding the matter.
The company stated that listing on the Hong Kong stock market is an important strategic layout, with the core purpose of expanding overseas financing channels, optimizing global business layout, enhancing international brand influence, helping the company further expand overseas markets, deepening cooperation with global customers, and benefiting the company's value and shareholder interests in the long run. In the future, the company will strictly comply with regulatory requirements, disclose IPO progress in a timely manner, and ensure information transparency.
Continuous increase in technology research and development, consolidating the foundation for long-term development
As a national specialized, refined, and innovative "little giant" enterprise, Audi Wei has always adhered to technological innovation. In 2024, its research and development expenses increased by 17.13% year-on-year, with 301 new patents added and a R&D personnel ratio of over 16%. In addition to robot sensors and heat dissipation solutions, the company is actively expanding into the field of flexible sensors (electronic skin), with research and development directions covering multifunctional integration such as touch, pressure sensing, and temperature sensing. Currently, the company has collaborated with research teams to develop and downstream verification work is steadily advancing, with the potential to become a new technological growth point for the company in the future.
Risk Warning: This article is based on the announcements and public information of listed companies and does not constitute investment advice. The market is risky, and investment needs to be cautious.
